Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c20c3fe8ff8452663ba93cb7850efa24 |
publicationDate |
2013-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2013203928-A |
titleOfInvention |
Epoxy resin composition for sealing, electronic device, and method for manufacturing electronic device |
abstract |
[PROBLEMS] To provide a sealing material having a high degree of anti-adhesion property capable of suppressing the mutual adhesion of a part of epoxy resin compositions for sealing, which may occur after being contained in a granular sealing resin composition packaging material. An epoxy resin composition is provided. A granular sealing epoxy resin composition used for sealing an element by compression molding, comprising: (a) an epoxy resin; (b) a curing agent; and (c) an inorganic filler. As an essential component, the powdery glass transition temperature of the sealing epoxy resin composition measured using a temperature modulation differential scanning calorimeter is 12 ° C. or more and 35 ° C. or less. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015125760-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7128112-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I663220-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018070301-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018070301-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016023279-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015125760-A1 |
priorityDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |