| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2001-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca8060609f0fa5646ab3cf887669c51e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cbccb9eccd9343e01da73d400cd58b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b56af378a25fa5aaeea36d5433fdcd30 |
| publicationDate |
2002-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002275353-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract |
(57) Abstract: An epoxy resin composition for semiconductor encapsulation having good fluidity during molding and excellent adhesion to a semiconductor member, and a semiconductor encapsulated with the encapsulating composition. Providing equipment. An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a silane coupling agent (D), wherein the silane coupling agent ( D) contains a silane coupling agent (d) represented by the formula (I): an epoxy resin composition for semiconductor encapsulation. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013203928-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003105168-A |
| priorityDate |
2001-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |