| abstract |
Disclosed is a granulated epoxy resin composition for semiconductor encapsulation, which is used for a semiconductor device that is obtained by encapsulating a semiconductor element by compression molding. The granulated epoxy resin composition for semiconductor encapsulation is characterized in that, in the particle size distribution as determined by sieving the whole epoxy resin composition for semiconductor encapsulation using JIS standard sieves, the ratio of particles having a size of 2 mm or greater is not more than 3% by mass, the ratio of particles having a size of 1 mm or greater, but less than 2 mm is not less than 0.5% by mass but not more than 60% by mass, and the ratio of microfine particles having a size of less than 106 μm is not more than 5% by mass. |