| abstract |
The present invention provides an epoxy resin composition for encapsulating a semiconductor device, comprising: an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler, wherein the coupling agent comprises an alkylsilane compound represented by Formula 1: n n n n n n n n n n n n wherein R 1 , R 2 and R 3 are each independently a C 1 to C 4 alkyl group, R is a C 6 to C 31 alkyl group, and n ranges from about 1 to 5 on average. |