| abstract |
Provided are a substrate processing method and a substrate processing apparatus that suppress pattern collapse during drying after liquid processing. According to an embodiment, a substrate processing method is provided. The substrate processing method includes a step of processing a substrate having a structure formed on at least a main surface with a liquid. In the substrate processing method, a solution is brought into contact with the structure wet with the liquid, the solution is reacted, the amount of the solvent contained in the solution is reduced, and the substance dissolved in the solvent The method further includes the step of forming at least a part of the solution into a solid by at least one of depositing at least a part to form a support material that supports the structure. The substrate processing method further includes a step of removing the support material by changing the support material from a solid phase to a gas phase without passing through a liquid phase. [Selection] Figure 1 |