http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008031272-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-40 |
| filingDate | 2006-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3db240bb385a8bc59254ddbd7e0848fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd3f70aeaee5ec18eff393ca36eb1d4 |
| publicationDate | 2008-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008031272-A |
| titleOfInvention | Liquid resin composition and semiconductor device produced using liquid resin composition |
| abstract | A liquid resin composition having low viscosity, excellent workability, good adhesion and low elastic modulus, and solder resistance by using the liquid resin composition as a die attach material for a semiconductor or an adhesive for a heat dissipation member A semiconductor device having excellent reliability such as cracking property is provided. The present invention provides a liquid resin composition for adhering a semiconductor element or a heat radiating member to a support, comprising a filler (A) comprising only a compound having two functional groups of the same type in one molecule. A liquid resin composition comprising a curable resin (B), a curing catalyst (C), and an additive (D) as essential components. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012116979-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011079904-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011079905-A |
| priorityDate | 2006-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 192.