| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de07f14bc25508907c9b0499473c5fda |
| publicationDate |
2012-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012116979-A |
| titleOfInvention |
Epoxy resin composition, semiconductor sealing resin composition, and semiconductor device |
| abstract |
A toughened epoxy resin composition is provided without blending fine particles or a polymer. An epoxy resin composition comprising (a) an epoxy resin, (b) a curing agent for the epoxy resin, and (c) a modifier having at least one acrylic group in the molecule, the epoxy resin An epoxy resin composition, wherein a cured product of the composition is tougher than a cured product of a resin composition containing (a) an epoxy resin and (b) a curing agent for the epoxy resin. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019157056-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014073220-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022039121-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017188286-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7238259-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013181132-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7343977-B2 |
| priorityDate |
2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |