http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005272709-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc7831f3c9e679cf024e942d77c21da3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd3f70aeaee5ec18eff393ca36eb1d4 |
| publicationDate | 2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005272709-A |
| titleOfInvention | Resin composition and semiconductor device produced using resin composition |
| abstract | [PROBLEMS] To provide a resin composition exhibiting good adhesion to a lead frame and the like and at the same time having good low stress, and reliability such as solder crack resistance by using the resin composition as a die attach material for a semiconductor. An excellent semiconductor device is provided. [Solution] Compound (A), liquid epoxy compound (B), phenolic compound (C) having a structure represented by general formula (1) in the main chain skeleton and having at least two radically polymerizable carbon-carbon unsaturated bonds A resin composition comprising, as essential components, an imidazole compound (D) having a melting point of 180 ° C. or higher, a radical polymerization initiator (E) that is not a photopolymerization initiator, and a filler (F). [Chemical 1] R 1 in the general formula (1) is a hydrocarbon group having 3 to 6 carbon atoms, n is an integer from 2 to 20. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008031272-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007234842-A |
| priorityDate | 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.