| abstract |
PROBLEM TO BE SOLVED: To provide a resin paste composition having a low electric resistivity and a high thermal conductivity and excellent in adhesion, and a semiconductor device which is easily manufactured using the same. SOLUTION: (A) an acrylate compound or a methacrylate compound, (B) an acrylonitrile-butadiene copolymer, (C) an epoxidized polybutadiene, (D) a radical initiator, (E) an epoxy resin having no vinyl polymerizable unsaturated double bond, (F) a resin paste composition containing an epoxy resin curing agent and (G) a metal filler, and the resin paste A semiconductor device in which a semiconductor element is bonded to a supporting member using a composition. |