| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor which has excellent mold release properties and continuous moldability and has excellent solder resistance. SOLUTION: (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) a curing accelerator, (D) an epoxy resin composition containing an inorganic filler as a main component, the (A) epoxy resin, At least one of the (B) phenolic resin-based curing agent includes a resin represented by the general formula (1), and (E) 0.01 wt% or more of glycerin trifatty acid ester in the total epoxy resin composition. A butadiene-acrylonitrile copolymer (f1) having a proportion of 1% by weight or less and having a carboxyl group and / or a reaction product (f2) of a butadiene-acrylonitrile copolymer having a carboxyl group and an epoxy resin Is contained in the total epoxy resin composition in a proportion of 0.01% by weight or more and 1% by weight or less. |