http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007009180-A

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filingDate 2006-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007009180-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor, which has good releasability during molding and continuous moldability and has excellent solder resistance. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) a curing accelerator, and (D) an inorganic filler as a main component. And (B) at least one of the phenol resin-based curing agents contains a novolac resin having a biphenylene skeleton in the main chain, and (E) 0.01 wt.% Of oxidized polyethylene wax in the total epoxy resin composition. (F) a butadiene-acrylonitrile copolymer (f1) having a carboxyl group and / or a carboxyl group-containing butadiene-acrylonitrile copolymer and an epoxy resin (%). The epoxy resin composition for semiconductor encapsulation containing f2) at a ratio of 0.01 wt% or more and 1 wt% or less in the total epoxy resin composition. [Selection figure] None
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