http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007009180-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
filingDate | 2006-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
publicationDate | 2007-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007009180-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor, which has good releasability during molding and continuous moldability and has excellent solder resistance. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) a curing accelerator, and (D) an inorganic filler as a main component. And (B) at least one of the phenol resin-based curing agents contains a novolac resin having a biphenylene skeleton in the main chain, and (E) 0.01 wt.% Of oxidized polyethylene wax in the total epoxy resin composition. (F) a butadiene-acrylonitrile copolymer (f1) having a carboxyl group and / or a carboxyl group-containing butadiene-acrylonitrile copolymer and an epoxy resin (%). The epoxy resin composition for semiconductor encapsulation containing f2) at a ratio of 0.01 wt% or more and 1 wt% or less in the total epoxy resin composition. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101639927-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013136769-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013136769-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014062173-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I576364-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140123065-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104136480-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010280805-A |
priorityDate | 2005-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.