| abstract |
According to the present invention, there is provided a resin composition for encapsulating electronic parts, which comprises a phenolic resin curing agent, an epoxy resin, and a release agent having a 5% weight reduction temperature of 240 캜 or higher, an epoxy resin and a release agent containing 5% (Tg) of a cured product of a sealing resin composition, wherein the resin composition for sealing an electronic part, a phenol resin curing agent, an epoxy resin, and a releasing agent having a 5% Is 200 占 폚 or higher and the weight loss rate of the cured product when heated at 200 占 폚 for 1000 hours in an atmospheric atmosphere is 0.3% or less; and an electronic component sealed with the resin composition An electronic device is provided. |