abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in toughness and heat resistance, a resin composition for semiconductor sealing filling, and a semiconductor device manufactured using the same. The epoxy resin composition of the present invention comprises (a) an epoxy resin, (b) a curing agent, (c) a flexible epoxy resin, and (d) a compound having an acrylic group or a methacryl group. [Selection figure] None |