| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
2006-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3db240bb385a8bc59254ddbd7e0848fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd3f70aeaee5ec18eff393ca36eb1d4 |
| publicationDate |
2008-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008007558-A |
| titleOfInvention |
Liquid resin composition and semiconductor device produced using liquid resin composition |
| abstract |
A liquid resin composition having low viscosity, excellent workability, good adhesion and low elastic modulus, and solder resistance by using the liquid resin composition as a die attach material for semiconductors or an adhesive for heat dissipation members A semiconductor device having excellent reliability such as cracking property is provided. The present invention relates to a liquid resin composition for adhering a semiconductor element or a heat radiating member to a support, the filler (A), a compound (B1) having two glycidyl groups in one molecule and one molecule. A liquid resin composition comprising a thermosetting resin (B) containing a compound (B2) having two (meth) acryloyl groups therein and an additive (C) as essential components. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9416219-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9869463-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008031272-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140059705-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016189829-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012283352-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016189829-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022202505-A1 |
| priorityDate |
2006-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |