| abstract |
The low dielectric constant amorphous silica-based film has a small relative dielectric constant of 2.5 or less, a Young's modulus of 6.0 GPa or more, and excellent hydrophobicity. A liquid composition containing a silicon compound obtained by hydrolyzing a tetraalkylorthosilicate (TAOS) and a specific alkoxysilane (AS) in the presence of a tetraalkylammonium hydroxide (TAAOH) is prepared. (B) a step of applying the liquid composition onto the substrate, (c) a step of heat-treating the substrate at a temperature of 80 to 350 ° C., and (d) a step of 350 to 450 ° C. And a step of firing at a temperature. [Selection figure] None |