abstract |
PROBLEM TO BE SOLVED: To provide a metal polishing liquid having a high productivity and a low dishing and erosion due to a high metal polishing rate and a low etching rate. The present invention provides a metal polishing slurry having excellent electrical characteristics and suitable for manufacturing a highly reliable semiconductor device. SOLUTION: The polishing liquid contains a metal oxidizing agent, a metal oxide dissolving agent, a metal anticorrosive, and water, and the metal anticorrosive contains a compound having a pyrimidine skeleton. |