| abstract |
(57) [Summary] [PROBLEMS] To provide excellent filling and releasing properties for thin semiconductor devices, An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which is excellent in solder resistance of a semiconductor device. SOLUTION: An epoxy resin represented by the general formula (1), An epoxy resin composition comprising a phenol resin represented by the general formula (2), a fused silica powder, a curing accelerator, and a release agent as essential components, wherein the release agent is an oxidized polyolefin having an acid value of 10 to 30, An epoxy resin composition for semiconductor encapsulation, which is at least one selected from oxidized paraffins having a valence of 10 to 30. Embedded image (R in the formula is a hydrogen atom, a halogen atom, or a carbon atom 1 Which may be the same or different, and n is an average value and is a positive number of 1 to 5) (R in the formula is a hydrogen atom, a halogen atom, or a carbon atom 1 A group selected from the alkyl groups from 1 to 9, which may be the same or different, and n is an average value and a positive number of 1 to 5) |