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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
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filingDate 2010-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8143b1dddf3e66be8e2e70ac832b4718
publicationDate 2012-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012001592-A
titleOfInvention Method for producing epoxy resin composition for module sealing
abstract The present invention provides a simple method for producing an epoxy resin composition for module sealing having excellent adhesion to a plated lead frame and a solder resist. A method for producing an epoxy resin composition for module encapsulation containing the following components A to F, comprising: A step of obtaining a masterbatch with B component, D component and E component; Adding A component, C component and F component to the masterbatch to obtain a melt-kneaded product, The manufacturing method of the epoxy resin composition for module sealing characterized by including these. A: Epoxy resin B: Phenol resin C: Imidazole derivative having a melting point of 200 to 260 ° C., which is an adduct of a triazine compound having a vinyl group and an imidazole compound D: Curing accelerator other than C component E: Acid value of 10 to 30 mg KOH / G wax F: inorganic filler [selection figure] None
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