| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2001-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43f83ebd2e089814eca7bbad9f1fb8a8 |
| publicationDate |
2002-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002275245-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in fluidity and solder crack resistance. (A) A phenol aralkyl type epoxy resin containing a diphenylene skeleton is contained in all epoxy resins in an amount of 50 to 50%. 100% by weight of (B) a phenol aralkyl resin containing a diphenylene skeleton in a total amount of 50-100 (C) a hardening accelerator, (D) an inorganic filler, and (E) an amide compound of an unsaturated fatty acid having 18 to 26 carbon atoms having one double bond as essential components. Epoxy resin composition for sealing. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019087986-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010280805-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7226328-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019087986-A1 |
| priorityDate |
2001-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |