| abstract |
(57) [abstract] (with correction) [PROBLEMS] To be excellent in the filling property and release property for thin semiconductor devices, An epoxy resin composition for semiconductor encapsulation which is excellent in solder resistance of a semiconductor device. SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a fused silica powder, (D) a curing accelerator, and (E) a long-chain fatty acid or a long-chain fatty acid amide. An epoxy resin composition containing at least one kind of release agent as an essential component and containing at least one kind selected from an epoxy resin represented by the following general formula (1) or a phenol resin represented by the following general formula (2) Heat and mix, then (F) An epoxy resin composition for semiconductor encapsulation comprising at least one selected from long-chain fatty acid esters, metal salts of long-chain fatty acids, polyolefin oxides, and paraffin oxides. (Wherein, R is a group selected from hydrogen, an alkyl group, or a halogen atom, and n is an average number and a positive number of 1 to 5) |