| abstract |
(57) [Problem] To provide an epoxy resin composition having excellent characteristics of room temperature storage property, moldability, mold release property, flame retardancy and solder stress resistance. SOLUTION: (A) a phenol aralkyl type epoxy resin having a diphenylene skeleton, (B) a phenol aralkyl type resin having a diphenylene skeleton, (C) all inorganic substances, and (D) tetraphenylphosphonium tetrakis (1- Naphthoyloxy) borate and (E) urethane of oxidized microcrystalline wax and urethane of oxidized polyethylene wax are essential components, and all inorganic substances are 87 to 94 in all epoxy resin compositions. % By weight, and the urethane compound of oxidized microcrystalline wax and the urethane compound of polyethylene oxide wax are 0.05 to 0.4% by weight of the total epoxy resin composition. object. |