http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002179882-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2000-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ef3ceca090e7dc42db25e360025571 |
| publicationDate | 2002-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002179882-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in moldability, solder crack resistance, flame retardancy, moisture resistance reliability and high-temperature storage property. SOLUTION: (A) a phenol aralkyl type epoxy resin containing a diphenylene skeleton, (B) a phenol aralkyl resin containing a diphenylene skeleton, (C) a curing accelerator, An epoxy resin composition for semiconductor encapsulation, comprising (D) an inorganic filler and (E) a glycidylamine-type epoxy compound of the following formula as essential components. Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002317102-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4692885-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022024727-A1 |
| priorityDate | 2000-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.