| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-72 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 |
| filingDate |
2004-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4692885-B2 |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9120828-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9238663-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9243005-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3428172-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3424933-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2813510-A1 |
| priorityDate |
2003-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |