| abstract |
[PROBLEMS] To provide an epoxy resin composition excellent in flame retardancy, curability, reflow reliability and moldability, and a semiconductor device encapsulated by a cured product thereof. An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a filler (C), wherein the epoxy resin (A) is represented by the following general formula (I): An epoxy resin composition comprising a type epoxy resin (a) and a curing agent (B) containing a phenol compound having a repeating unit structure represented by the following chemical formulas (II) and (III): . Furthermore, the epoxy resin composition characterized in that the amount of the filler (C) is 80 to 96% by weight. |