| abstract |
An object of the present invention is to provide an epoxy resin composition excellent in fluidity, adhesion to a substrate, flame retardancy, and solder crack resistance without using a bromine-containing organic compound or antimony compound. . According to the present invention, a phenol aralkyl type epoxy resin having a biphenyl skeleton, a phenol aralkyl resin having a biphenyl skeleton, a curing accelerator, an inorganic filler, a specific silane coupling agent having a secondary amine, and a specific having a mercapto group An epoxy resin composition for encapsulating a semiconductor is provided which comprises the above silane coupling agent as an essential component. |