| abstract |
Provided is a silicone exhibiting hot-melt properties which is obtained by inducing, in the presence of a hydrosilylation reaction catalyst (C), a hydrosilylation reaction between an alkenyl-group-containing organopolysiloxane (A) in which phenyl groups account for at least 10 mol% of all silicon-bonded organic groups, and an organopolysiloxane (B) including at least two silicon-bonded hydrogen atoms per molecule. The silicone exhibiting hot-melt properties is not a liquid at 25˚C, and has a melt viscosity at 100˚C of not more than 5,000 Pa∙s. Also provided is a curable hot-melt composition which comprises at least: the silicone (I) exhibiting hot-melt properties; an organopolysiloxane (II) which includes at least two silicon-bonded hydrogen atoms per molecule, and which includes at least 0.5 mass% of silicon-bonded hydrogen atoms; and a hydrosilylation reaction catalyst (III). The silicone exhibiting hot-melt properties is not a liquid at 25˚C, has low surface tack, and is easily melted by being heated. Furthermore, the curable hot-melt composition exhibits both curability and hot-melt properties. |