| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d133e5594f9e2e77d654be29c12543f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aba6ee07d0e0d0d4b8b3ab381367ee6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cf60c50ebbcc105ad4ec6316edfa3078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_94ea880e453bd3a4588c08ffec3bb6a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c2bdc86e572510e8b947df9bb3edb374 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 |
| filingDate |
2010-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a934f9bf275cbdc42381f17e6046f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_221101069b1d553d6965bf63440d4a9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c249ee116dbfd011855abd36e91ec76b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d801c44552a78167718d4cbd365731a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec45894031f5c57bb1e2067eb10544b4 |
| publicationDate |
2014-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8809183-B2 |
| titleOfInvention |
Interconnect structure with a planar interface between a selective conductive cap and a dielectric cap layer |
| abstract |
A selective conductive cap is deposited on exposed metal surfaces of a metal line by electroless plating selective to exposed underlying dielectric surfaces of a metal interconnect structure. A dielectric material layer is deposited on the selective conductive cap and the exposed underlying dielectric layer without a preclean. The dielectric material layer is planarized to form a horizontal planar surface that is coplanar with a topmost surface of the selective conductive cap. A preclean is performed and a dielectric cap layer is deposited on the selective conductive cap and the planarized surface of the dielectric material layer. Because the interface including a surface damaged by the preclean is vertically offset from the topmost surface of the metal line, electromigration of the metal in the metal line along the interface is reduced or eliminated. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11637058-B2 |
| priorityDate |
2010-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |