abstract |
The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. The method includes depositing a first layer of organic materials over a substrate; depositing a second layer of an electrode material over the first layer of organic materials; pressing a patterned die having a raised portion onto the second layer; and removing the patterned die. Preferably the patterned die is coated with a metal. Optionally the method includes depositing additional layers over the substrate prior to pressing the patterned die. |