Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-166 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
filingDate |
1997-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2000-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2eab7b90a588d8295f134a60e59c775f |
publicationDate |
2000-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-6146700-A |
titleOfInvention |
Pretreating solution for electroless plating, electroless plating bath and electroless plating process |
abstract |
As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating; and a pretreating solution for electroless plating comprising an alkali solution, reducing agent and complexing agent; and an electroless plating bath suitable for use in this method. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010120962-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103476199-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103476199-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6580061-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10927463-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006280860-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005156362-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6433319-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9942982-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6544583-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004013601-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114150299-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019264329-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6674053-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006121200-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8796374-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6936564-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7081602-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6663914-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8636912-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8159056-B1 |
priorityDate |
1994-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |