| abstract |
PCT No. PCT/DE91/00498 Sec. 371 Date Mar. 25, 1993 Sec. 102(e) Date Mar. 25, 1993 PCT Filed Jun. 13, 1991 PCT Pub. No. WO92/00398 PCT Pub. Date Jan. 9, 1992.The invention relates to a combination of aqueous baths for electroless gold deposition and, preferably, for the deposition of gold onto nickel and nickel alloy films. The combination consists of a preliminary bath and a primary bath and, optionally, a pickling solution and a pretreatment. The gold film which is obtained is chip-bondable and wire-bondable. |