| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74fe32fcbcc8fde8f2ad30af88d69ad8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c9de556a7402c6a081a78d81d9573e33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1c2d1b17808513c2549c0ab26f24078d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0136 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate |
2012-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b45f048c6dcf90400be9740566fa7661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce54e6ee682b79c64f54f62003d57f4b |
| publicationDate |
2014-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8636912-B1 |
| titleOfInvention |
Package for an electronic device |
| abstract |
A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portion. In addition, an encapsulation layer having a cover portion and a perimeter portion is formed over the sacrificial layer. The cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion. The perimeter portion is disposed over the tunnel portion. Moreover, an access hole is formed in the perimeter portion of the encapsulation layer. |
| priorityDate |
2008-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |