abstract |
A printed circuit inner-layer copper foil having inverted tear drop-shaped fine nodules formed on both surfaces of a copper foil each having surface roughness Rz=1 to 3 μm, the nodules having a length of 0.6 to 1.0 μm and a maximum diameter of 0.2 to 0.8 μm, and a process for producing said inner-layer copper foil. |