| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12646 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2013-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e58c5ac0d332b2f61c2abf8ce2929f6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1a4bb340dde0e170836f6152a0ccec0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1f135cc91a0b20012b2b0d9e951c17a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76cfb9f6002a52cb958a1808ded64327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a847589aa75adf99a2bf230246e47774
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fa7e83ad745fff93cc18c2bdfe39cf5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2a10f6217299ae7e5a26ffe3bca508b |
| publicationDate |
2014-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014186651-A1 |
| titleOfInvention |
Printed circuit board having copper plated layer with roughness and method of manufacturing the same |
| abstract |
Disclosed herein are a printed circuit board having a copper plated layer with an anchor shaped surface and roughness by forming the copper plated layer having an anisotropic crystalline orientation structure using a plating inhibitor at the time of forming the copper plated layer serving as a circuit wiring and using composite gas plasma and a dilute acid solution, and a method of manufacturing the same. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I759667-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I784881-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11499233-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10068824-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10332792-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112080779-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11528801-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106211585-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10811313-B2 |
| priorityDate |
2012-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |