Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_620d51f66ce5ac7dfbee190657844e48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4612f8e1b422b4bbe4a75deb989e62a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5044fea91e7f7145df33aa4fd3fdadcd http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9be7c3981d831e9f09fc4f49fafea5c3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12882 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12903 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12993 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12451 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12472 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
filingDate |
2006-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2014-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31812b22ee5264efce339e6896333d3e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a5a06556141261a5348ff1bf630ee06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7db3a086b3a366d9e6ed9fee550bcb1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a737ccecfd5f57c6c4d162f116b1da2 |
publicationDate |
2014-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8722199-B2 |
titleOfInvention |
Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil |
abstract |
It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9365942-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016260980-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I675128-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013188324-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014193660-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9899683-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10697077-B1 |
priorityDate |
2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |