| abstract |
To provide a new plating method capable of filling a via or a wiring groove having an opening width of several tens of μm and an aspect ratio of 1.5 or more. A conductor layer is formed on at least a part of a substrate on which a circuit pattern is formed in an uneven shape, a cathode potential is applied to the conductor layer, and the conductor layer is in electrical contact with the anode. A plating method for embedding a concavo-convex pattern on a conductor layer with a plating film by supplying a plating solution, and a copper ion, organic acid or inorganic acid, chlorine ion, a polymer that suppresses electrodeposition as the plating solution A plating method comprising: a surface active agent, a sulfur-based saturated organic compound that promotes plating growth, and a nitrogen-containing polymer polymer that flattens plating growth. [Selection figure] None |