| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64f865523ae8fb5ef8dfabb540489ca3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 |
| filingDate |
2007-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57edf585095d01f89e096678cbb7be87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_357ce07a9112450763c872598a6899c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e91fdb9951034d4d5e2e2a7339ba0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6391509f00ffe2015a6aa8f47edb13e1 |
| publicationDate |
2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8003216-B2 |
| titleOfInvention |
Heat-conductive dielectric polymer material and heat dissipation substrate containing the same |
| abstract |
A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011214852-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013188318-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8946333-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10047264-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9434870-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8652641-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8502638-B1 |
| priorityDate |
2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |