| abstract |
A method of making a multilayer thin film structure on the surface of a dielectric substrate which includes the steps of: n a. forming a multilayer thin film structure including the steps of: n applying a first layer of dielectric polymeric material on the surface of a dielectric substrate, n applying a second layer of dielectric polymeric material over the first layer of polymeric material wherein the second polymeric material is photosensitive, n imagewise exposing and developing the second polymeric material to form a feature therein, the second layer feature in communication with at least one feature formed in the first polymeric material; and n b. filling the features in the entire multilayer structure simultaneously with conductive material. n Preferably, the first layer feature is a via and the second layer feature is a capture pad or wiring channel. Also disclosed is a multilayer thin film structure made by this method. |