| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7681 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
1999-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1a81a994de9e0f61b82e12efb0e5726
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9a91d36826255f77268709731dab477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56b88a36db5187c86d1aa66fea7da744
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3350609f60e95fa199b2ee86edd833ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a713fc41e086db9616ac88b610bacc35 |
| publicationDate |
2000-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
FR-2782839-A1 |
| titleOfInvention |
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE |
| abstract |
A method of manufacturing a semiconductor device comprises the steps (A) of forming a concave portion (14) in an insulating interlayer (13) formed on a substrate (11) such that part of the substrate is exposed in a bottom of the concave part, (B) forming a first electrically conductive layer (16) on the insulating inter-layer including in the interior of the concave part, by means of a process electroplating and (C) forming a second electrically conductive layer (17) on the first electrically conductive layer by means of an electroplating process, to fill the concave portion with the second electrically conductive layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9788427-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9295163-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014352135-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102006056620-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7638428-B2 |
| priorityDate |
1998-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |