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titleOfInvention Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
abstract A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.
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