abstract |
According to one embodiment of the invention, a method is provided for selective surface deposition. In one example, the method includes providing a substrate containing a first material having a first surface and a second material having a second surface, forming a modified first surface and a modified second surface by exposing the first surface and the second surface to hydrogen gas excited by a plasma source, and selectively depositing a film on the modified second surface but not on the modified first surface. |