Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0276 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0332 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76808 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2018-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7f61dac0b82b38a45582a199404bbc7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cddf25a8e58f6a7bfecf3af41c6bfa8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35a171611f2a9a9ba09b92ba04f6ee3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_710d38b84a1938d74607ac3fe15ba2d0 |
publicationDate |
2020-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10692755-B2 |
titleOfInvention |
Selective deposition of dielectrics on ultra-low k dielectrics |
abstract |
A method for fabricating a semiconductor device includes forming a via in a first dielectric layer arranged on a metal layer. The via exposes a portion of the metal layer. The method includes forming a trench in the first dielectric layer. The method further includes depositing, by a selective process, a second dielectric layer on the first dielectric layer such that the second dielectric layer lines sidewalls of the via and the trench and is selectively deposited onto the first dielectric layer. |
priorityDate |
2018-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |