| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2008-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3224c3bdfc81965402ef4cd0048c1847
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb4026e48c1304593f725556438965bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70b92dcb83b9cd0a09368b07e0cf4f5f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67196f4c43f408d651ae43a1e597d79e |
| publicationDate |
2010-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010038789-A1 |
| titleOfInvention |
Conformal adhesion promoter liner for metal interconnects |
| abstract |
A dielectric layer is patterned with at least one line trough and/or at least one via cavity. A metallic nitride liner is formed on the surfaces of the patterned dielectric layer. A metal liner is formed on the surface of the metallic nitride liner. A conformal copper nitride layer is formed directly on the metal liner by atomic layer deposition (ALD) or chemical vapor deposition (CVD). A Cu seed layer is formed directly on the conformal copper nitride layer. The at least one line trough and/or the at least one via cavity are filled with an electroplated material. The direct contact between the conformal copper nitride layer and the Cu seed layer provides enhanced adhesion strength. The conformal copper nitride layer may be annealed to covert an exposed outer portion into a contiguous Cu layer, which may be employed to reduce the thickness of the Cu seed layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I725459-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9177826-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016064321-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8048761-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9728503-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015179591-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8481425-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9553059-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11004794-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10079174-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9735050-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012295437-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010207237-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11776910-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10504778-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9929108-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016260633-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10541213-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I502716-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013203266-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109671666-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019115254-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102082119-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016064330-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10276432-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10892186-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9666529-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9379057-B2 |
| priorityDate |
2008-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |