http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7289183-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3c754156d9ab873a2efe5a3990dbf627
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-974
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-3607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4908
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-3671
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-3626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-3618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-3649
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-124
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1343
filingDate 2005-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02fecf56afc897c936318fbafe9173b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5085b2eeac7a80c6169350619153e49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48827066209e51f0b37558551cb2ea8e
publicationDate 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7289183-B2
titleOfInvention Copper conducting wire structure and fabricating method thereof
abstract A copper conducting wire structure is for use in the thin-film-transistor liquid crystal display (LCD) device. The copper conducting wire structure includes at least a buffer layer and a copper layer. A fabricating method of the copper conducting wire structure includes the following steps. At first, a glass substrate is provided. Next, the buffer layer is formed on the glass substrate. The buffer layer is comprised of a copper nitride. At last, the copper layer is formed on the buffer layer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8451394-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009162982-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8859419-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009087936-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010038789-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008017862-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8105937-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8389313-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7902670-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7511300-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8270178-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8681282-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7586197-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011014788-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8062917-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011228502-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007013077-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8753975-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9318436-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9256110-B2
priorityDate 2005-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6111619-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7157323-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003112382-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6562668-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6319741-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6506675-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004041958-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448528323
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID74765618

Total number of triples: 66.