| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c78d80e9d323ad7c79518c80e0b8d16 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-585
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 |
| filingDate |
2009-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f68874a6f5e1dcb3e19cbe075dd9fef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e32761b83105b2fe147615de0a90b06 |
| publicationDate |
2010-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010207237-A1 |
| titleOfInvention |
Crack stop structure enhancement of the integrated circuit seal ring |
| abstract |
An improved crack stop structure (and method of forming) is provided within a die seal ring of an integrated circuit die to increase crack resistance during the dicing of a semiconductor wafer. The crack stop structure includes a stack layer (of alternating insulating and conductive layers) and an anchor system extending from the stack layer to a predetermined point below the surface of the substrate. A crack stop trench is formed in the substrate and filled with material having good crack resistance to anchor the stack layer to the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10014369-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11037873-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10998231-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8860185-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10304782-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10083921-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10978395-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014367835-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11239188-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113725167-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10700019-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9048246-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10734320-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11031321-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017309705-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9711463-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11127693-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019038352-A1 |
| priorityDate |
2009-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |