| abstract |
A polishing composition comprising silica particles, polymer particles and a cationic compound in an aqueous medium; a polishing process for a substrate for a precision part with the polishing composition as defined above; a method for planarization of a substrate for a precision part, including the step of polishing the substrate for a precision part with the polishing composition as defined above; and a method for planarization of a substrate for a precision part, including the steps of polishing the substrate for a precision part with the polishing composition as defined above, the polishing composition being a first polishing composition, with applying a polishing load of 50 to 1000 hPa, and polishing the substrate after the first step with a second polishing composition comprising silica particles in an aqueous medium with applying a polishing load of 50 to 1000 hPa. The polishing composition is, for instance, useful in planarization of a semiconductor substrate having a thin film formed on its surface having dents and projections. |