| abstract |
A process for producing a silica-based film which comprises irradiating a film comprising at least one siloxane compound having a radius of gyration of from 5 to 50 nm with electron beams to thereby convert the film into a film having a dielectric constant of 3 or lower is disclosed. The film has an even thickness, is excellent in storage stability, dielectric constant, mechanical strength, etc., has low hygroscopicity, and is suitable for use as a dielectric film in semiconductor devices and the like. |