| abstract |
To provide a ceramic heater capable of reducing temperature uniformity at the periphery of through holes such as insertion holes and vacuum suction holes, thereby protecting the wafer against thermal shocks and having improved controllability for temperature control parts such as thermocouples and temperature fuse. Further, a ceramic heater capable of uniform resin curing is provided. A heat generation body 14 is disposed on the surface or inside of the ceramic substrate 12. Further, corners for the insertion holes 16, the recesses 18 and the vacuum suction holes 20 of the ceramic substrate 12 are chamfered. |