| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d1a147228feb227e208a391aa580497 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-32 |
| filingDate |
2017-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_114002e1607d9201a075ff862070a531
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_464d37ea425e890ba35390eb64f1c220 |
| publicationDate |
2022-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11402754-B2 |
| titleOfInvention |
Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device |
| abstract |
The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11609493-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020019054-A1 |
| priorityDate |
2016-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |