| abstract |
An epoxy resin composition comprisingn (1) an epoxy resin, (2) a polymer obtained by reacting anpolycarbodiimide with a compound having, in the molecule, atnleast one group reactive with carbodiimide group, between thencarbodiimide group of said polycarbodiimide and the groupnreactive with carbodiimide group, of said compound, and (3) a curing agent for epoxy resin. n The above epoxy resin composition alleviates thenproblems of the prior art; has a long pot life in a solutionnstate, has an appropriate gelling time and accordingly goodnworkability, is superior in film formability and handleabilitynin B-stage, and has high heat resistance after curing;ntherefore, is suitably used in printed wiring board, prepreg,netc. |