| abstract |
An object of the present invention ia to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a aubatrate. The present invention provides a material for forming an organic film, including: (A) a compound for formimg an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, nnoting that in the general formula (1A), when W 1 nrepresents any of n,R 1 ndoes not represent any of . |